What do I need to pay attention to when packaging chips for LED lights?

1. Chip inspection: Before encapsulation, the LED chip needs to be strictly inspected to ensure that there is no mechanical damage on the surface of the chip, pitting, electrode size and dimensions in line with the process requirements, electrode pattern is complete.

2. Expansion: the use of expansion machine will be stretched to about 0.6mm LED chip spacing, can also be used to manually expand, but easy to cause the chip fall waste and other issues

3. Dispensing and preparation of glue: in the corresponding position of the LED bracket point on the silver glue or insulating glue, the control of the amount of glue is the key. Preparing glue is to apply the silver glue on the electrode on the back of LED, and then mounted on the LED bracket, the efficiency of preparing glue is higher than dispensing, but not all products are applicable 1.

4. Sintering: the purpose of sintering is to make the silver adhesive curing, temperature control is very important, generally controlled at 150 ° C, sintering time of 2 hours, according to the actual situation can be adjusted

5. Selection of encapsulation materials: selection of better transparency of the encapsulation material, transparency ≥ 95%, refractive index greater than 1.5; selection of high excitation efficiency, high dominant phosphor, particle size is appropriate; mounting substrate to have a high reflectivity, high light rate of the optical design of the shape; selection of appropriate encapsulation process, especially the coating process

6. Heat dissipation design: the package needs to consider the heat dissipation problem, the use of efficient heat dissipation structure and process, optimize the internal and external optical design, in order to improve the overall system efficiency

7. Reliability: Selection of suitable packaging materials, bonding force should be large, low stress, well-matched, good airtight, temperature, humidity, UV resistance, etc.; the use of high thermal conductivity and high electrical conductivity of the substrate, high thermal conductivity, high electrical conductivity and high strength of the solid crystal material, the stress should be small

8. Cost-effectiveness: encapsulation in the entire LED lamp bead production costs account for a large proportion of the use of new encapsulation structure and technology to improve the light efficiency and cost ratio, is to achieve the key to commercialization of LED lamp beads